Strategic Objectives
• Master the metallurgy of silver sintering to achieve superior thermal conductivity.
• Navigate the transition from liquid-phase soldering to solid-state diffusion.
• Implement pressure and pressure-less processing techniques for maximum reliability.
• Analyze failure mechanisms to ensure long-term stability in extreme environments.
The Core Challenge
Traditional solders fail at the 200°C threshold, creating a massive bottleneck for Wide Bandgap semiconductors and high-density power modules.
01
The Evolution of Die-Attach
02
The Physics of Sintering
03
Silver as an Interconnect Material
04
Wide Bandgap Integration
05
The Metallurgy of Diffusion
06
Nanoparticle Synthesis
07
Paste Formulation and Rheology
08
Surface Metallization
09
Pressure-Assisted Sintering
10
Pressure-less Sintering Techniques
11
Thermal Management Systems
12
Microstructural Characterization
13
Mechanical Reliability
14
Coefficient of Thermal Expansion
15
Electromigration and Ion Transport
16
Oxidation and Environmental Degradation
17
Thermal Cycling and Shock
18
Power Module Architecture
19
Economic and Manufacturing Scalability
20
Future Trends: Hybrid Sintering
21
Standards and Quality Control
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