Strategic Objectives
• Eliminate thermal throttling in high-density computing environments.
• Integrate liquid cooling channels directly into silicon architectures.
• Master the fluid dynamics of micro-scale heat transfer.
• Reduce system footprint while dramatically increasing power efficiency.
The Core Challenge
Traditional air and surface cooling can no longer keep pace with the extreme heat flux of modern high-performance chips.
01
The End of Air Cooling
02
The Science of Small Flows
03
Moving the Heat
04
Etching the Path
05
The Silicon Interposer
06
Laminar vs. Turbulent Flow
07
Liquid Selection
08
The Pressure Drop Challenge
09
Two-Phase Cooling
10
Advanced Manifold Design
11
Materials Compatibility
12
Thermal Interface Materials
13
Simulating the Flow
14
Active vs. Passive Control
15
Integration with 3D ICs
16
Packaging Constraints
17
The Role of Nanotechnology
18
Reliability and Stress
19
Energy Efficiency
20
Commercial Applications
21