Strategic Objectives
• Master high-frequency wave behavior in silicon and glass horizontal routing layers.
• Implement advanced shielding techniques to eliminate inter-die crosstalk.
• Optimize transmission line geometry for 112G and 224G data rates.
• Navigate the complex trade-offs between signal density and electromagnetic compatibility.
The Core Challenge
As 2.5D integration pushes frequencies into the millimeter-wave regime, traditional routing rules fail against parasitic crosstalk and electromagnetic interference within the interposer.
01
The 2.5D Revolution
02
Electromagnetic Fundamentals
03
Transmission Line Theory
04
The Silicon Advantage
05
Glass Interposer Dynamics
06
Signal Integrity Essentials
07
Crosstalk Phenomena
08
Electromagnetic Compatibility
09
Shielding Techniques
10
Differential Signaling
11
Dielectric Loss Tangents
12
The Skin Effect in Thin Films
13
Reflection and Return Loss
14
S-Parameters for Interposers
15
RF Behavior of Passive Components
16
Redistribution Layer (RDL) Engineering
17
Near-Field Scanning
18
Thermal Impacts on Integrity
19
Modeling and Simulation
20
Measurement and Verification
21
The Roadmap to 3D Integration
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