Strategic Objectives
• Unlock the architectural secrets of 3D complementary device stacking.
• Understand the shift from FinFET and Nanosheets to the CFET paradigm.
• Navigate the complex fabrication challenges of vertical n-p integration.
• Future-proof your knowledge of sub-2nm semiconductor manufacturing.
The Core Challenge
As Moore's Law faces the physical wall of lateral scaling, traditional 2D transistor architectures can no longer deliver the density required for next-gen computing.
01
The End of Lateral Scaling
02
Foundations of the FET
03
The Evolution to FinFET
04
Nanosheets and Nanowires
05
CFET Architecture Defined
06
Silicon and Beyond
07
Doping and Junction Formation
08
Epitaxial Growth Techniques
09
Atomic Layer Deposition
10
Photolithography Challenges
11
Etching the Vertical Pillar
12
Metrology and Inspection
13
Thermal Management in 3D
14
Parasitic Capacitance
15
Interconnects and Routing
16
Design Technology Co-Optimization
17
Electronic Design Automation
18
Yield and Reliability
19
The Competitive Landscape
20
Beyond Silicon CFETs
21
The Future of Computing
Explore Research Ecosystem
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