Strategic Objectives
• Master micro-channel cooling architectures for high-flux heat dissipation.
• Optimize Thermal Interface Materials (TIMs) to eliminate contact resistance.
• Implement advanced packaging techniques tailored for SiC and GaN chips.
• Reduce system footprint while increasing reliability and power density.
The Core Challenge
Wide-bandgap semiconductors like SiC and GaN offer unprecedented efficiency, but their extreme power densities create thermal bottlenecks that traditional cooling cannot handle.
01
The Wide-Bandgap Revolution
02
Fundamentals of Heat Transfer
03
Thermal Resistance Networks
04
Power Module Packaging
05
Silicon Carbide Specifics
06
Gallium Nitride Dynamics
07
Thermal Interface Materials (TIMs)
08
Microchannel Cooling Architectures
09
Heat Sink Design and Optimization
10
Liquid Cooling Systems
11
Two-Phase Cooling Solutions
12
Heat Pipe Technology
13
Thermal Stress and Reliability
14
Direct Bonded Copper (DBC) Substrates
15
Computational Fluid Dynamics (CFD)
16
Advanced Die Attach Techniques
17
Fans and Forced Convection
18
Thermal Management in Electric Vehicles
19
Measurement and Testing
20
Emerging Materials in Thermal Management
21
The Future of Power Integration
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