Strategic Objectives
• Implement robust Known Good Die (KGD) strategies to ensure pre-stacking reliability.
• Master advanced fault isolation techniques for complex multi-chip modules.
• Optimize test costs while maximizing final assembly yield.
• Navigate the transition from wafer-level testing to systemic validation.
The Core Challenge
Traditional monolithic testing fails when faced with the complexity of 3D stacking and multi-die architectures, leading to catastrophic yield losses.
01
The Chiplet Revolution
02
Defining the Known Good Die
03
Yield Engineering Fundamentals
04
Wafer-Level Testing Protocols
05
Design for Testability (DFT)
06
The Boundary Scan Standard
07
Automatic Test Pattern Generation
08
Built-In Self-Test (BIST) Strategies
09
Fault Modeling and Simulation
10
Heterogeneous Integration Challenges
11
System-in-Package (SiP) Validation
12
Advanced Wafer Probing Technology
13
Failure Analysis Techniques
14
Automatic Test Equipment (ATE)
15
Statistical Process Control
16
Through-Silicon Via (TSV) Integrity
17
Thermal Management During Test
18
Signal Integrity in Multi-Die Interfaces
19
Reliability and Stress Testing
20
Adaptive Test Methodologies
21
The Future of Test and Yield
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