Strategic Objectives
• Master the mechanics of diamond wire slicing for ultra-hard materials.
• Understand the chemical-mechanical synergies required for planarization.
• Optimize material removal rates without sacrificing surface integrity.
• Navigate the complex tribological interactions at the molecular level.
The Core Challenge
Silicon Carbide's extreme hardness makes traditional wafer processing inefficient, leading to high defect rates and tool wear.
01
The Nature of Silicon Carbide
02
Fundamentals of Tribology
03
Crystallography and Cleavage
04
Mechanical Properties of Ceramics
05
The Slicing Process
06
Diamond Abrasives
07
Abrasive Machining Dynamics
08
Surface Roughness Metrology
09
Grinding and Lapping
10
Chemical Mechanical Planarization
11
Oxidation of Silicon Carbide
12
Slurry Chemistry and pH Control
13
Colloidal Science in Polishing
14
Polishing Pad Tribology
15
Preston's Equation and Modeling
16
Subsurface Damage Analysis
17
Thermal Effects in Tribology
18
Surface Chemistry and Adhesion
19
Cleaning and Contamination
20
Precision Engineering and Equipment
21